When using plasma cleaning equipment to treat solid materials on the surface, physical and chemical reactions are generally involved. There are two main types of chemical reactions. So how do you understand the two chemical reactions? What specific practical applications will there be?

Considering that the explanation of the chemical reaction equation is more convenient and intuitive, the reaction equation of the surface treatment process of the plasma cleaning equipment will also be explained for everyone. In the following reaction formulas, capital letters A, B, C, D, and M respectively represent different substances; lowercase letters s and g represent the solid form and gas form of the substance, respectively.
1. The plasma surface treatment process with the chemical formula A(g)+B(g)→C(s)+D(g):
The chemical reaction of this type of plasma cleaning equipment usually contains more than two reactive gases, and the generated plasma can chemically react with solid materials. This special process application includes plasma enhanced chemical vapor deposition (PECVD), plasma sputtering And plasma polymerization.
The plasma enhanced chemical vapor deposition method PECVD usually reacts two or more process gases in a plasma state to generate a new solid substance and form a thin film substance on the material substrate. This process has been widely used at present Optical film preparation and other fields.
Plasma sputtering is also a reaction that uses two or more gases to ionize into plasma. The difference is that one of the reactants is sputtered from the target using energetic particles, and then forms a thin film through the reaction. It belongs to the category of sputtering film production.
As for the plasma polymerization process of plasma cleaning equipment, in fact, the reactants generated by the plasma are organic monomers.
2. The plasma surface treatment process with the chemical reaction formula A(g)+B(g)+M(s)→AB(g)+M:
This reaction process represents that the surface of the solid material M mainly plays a catalytic role and can promote the dissociation and recombination of gas molecules. In the plasma reaction of this type of plasma cleaning equipment, it is often used in the field of special gas preparation.
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