Name	4D intelligent integrated plasma processing system
Plasma power supply model	CRF-APO-IP-XXHD-DXX
Power supply	220V/AC,50/60Hz
Power	800W*4set/ 25KHz
Power factor	0.98
Number of plasma spray guns	4(Max)
Processing height	5-15mm
Internal control mode	Digital control
External control mode	RS485/R5232.Analog communication port, start-stop I/O
Working gas	Compressed Air (0.4mpa)/N2(0.2mpa)

The cleaning method of plasma treatment can well remove the characteristics of slag

With the miniaturization of the diameter of HDI plates, the traditional chemical cleaning process can no longer meet the cleaning of the blind hole structure. The surface tension of the liquid makes it difficult for the liquid to penetrate into the hole, especially when processing the laser drilled micro blind hole plate. not good. At present, the hole cleaning processes applied to micro-buried blind holes mainly include ultrasonic cleaning and plasma cleaning. Ultrasonic cleaning is mainly based on the cavitation effect to achieve the purpose of cleaning. It belongs to wet processing, and the cleaning time is longer and depends on the cleaning solution. Decontamination performance increases the problem of waste liquid treatment.
The commonly used process at this stage is mainly the plasma cleaning process. The plasma treatment process is simple and environmentally friendly, with obvious cleaning effects (effects), and very effective for blind hole structures.
Plasma cleaning refers to the directional movement of highly activated plasma under the action of an electric field, and the gas solidification reaction occurs with the drilling dirt on the hole wall. At the same time, the generated gas products and some unreacted particles are discharged by the air pump . Plasma is generally divided into three steps in the blind hole cleaning of HDI boards. The first stage uses high-purity N2 to generate plasma, while preheating the printed board, so that the polymer material is in a certain active (chemical) state; second In the first stage, O2 and CF4 are used as the original gas, and O and F plasma are generated after mixing, which reacts with acrylic acid, PI, FR4, glass fiber, etc. to achieve the purpose of de-drilling; the third stage uses O2 as the original gas to generate plasma With reaction residues, the pore walls are cleaned.
In the plasma cleaning process, in addition to the plasma chemical reaction, the plasma also physically reacts with the surface of the material. The plasma particles knock off the atoms on the surface of the material or the atoms on the surface of the attached material, which is helpful for cleaning the etching reaction.

With the development of materials and technology, the realization of the buried blind hole structure will become smaller and more refined; when the blind hole is electroplated and filled, it will be more and more difficult to use the traditional chemical desmear method , And the cleaning method of plasma treatment can well overcome the characteristics of wet desmear, and can achieve a better cleaning effect on blind holes and micro holes, so as to ensure a good effect when blind holes are electroplated and filled ( fruit).