What are the advantages of plasma cleaning machine used in the pre-treatment of LED package dispensing, bonding, and sealing:
As for why the plasma cleaning machine is used in the LED packaging process, I have already introduced to you. In fact, the plasma cleaning equipment is a process equipment that meets the cleaning requirements of LED packaging. At this stage, in the actual process, it is mainly used for pre-dispensing and lead bonding. Before closing and sealing. Below, I will share with you and discuss the specific role and effect of plasma cleaning machine in the actual production process.
Plasma cleaning machine treatment before dispensing silver glue:

If there are contaminants invisible to the naked eye on the substrate, it will cause poor hydrophilicity, which is not conducive to the spread of silver glue and the sticking of the chip, and it may also cause damage to the chip during placement. Using plasma cleaning machine for surface treatment can form a clean surface and roughen the surface of the substrate, thereby improving its hydrophilicity, reducing the amount of glue, saving costs, and improving product quality.
Plasma cleaning machine treatment before wire bonding:
After the chip is pasted on the substrate, it is especially easy to add some fine particles or oxides during the curing process, that is, these contaminants will reduce the strength of the weld, resulting in false welds or poor weld quality. In order to improve this problem, plasma cleaning is required to increase the surface activity of the device, increase the bonding strength, and improve the stretching uniformity.
Plasma cleaning machine treatment process before LED sealing glue:
In the LED epoxy resin injection process, if residual pollutants are left, it will lead to the formation of foam and directly affect the quality and service life of the product. Therefore, in the actual production process, it is necessary to avoid the formation of bubbles in this process. After the plasma cleaning machine is processed, the bonding force of the chip, the substrate and the colloid can be improved, the formation of bubbles can be reduced, and the heat dissipation rate and the light extraction rate can be improved.
Plasma cleaning does not produce waste liquid during the LED packaging process, and can meet the surface treatment requirements of a variety of materials, without excessive requirements on the shape of the processed product. In addition, plasma cleaning machines also have significant advantages in terms of use cost, processing efficiency and environmental protection. It is foreseeable that with the steady and healthy development of my country's LED industry, plasma cleaning equipment and plasma surface treatment technology will be more widely used.