Why do semiconductor plasma cleaning equipment use more aluminum alloy cavities:
Commonly used materials for semiconductor plasma cleaning equipment include quartz glass, stainless steel, and aluminum alloys. The choices for different industries and application areas will vary. In the semiconductor industry, most semiconductor plasma cleaning equipment uses aluminum alloy. What are the reasons?

Plasma cleaning equipment used in the semiconductor industry is more particular about the choice of vacuum reaction chamber materials during the cleaning and etching process. After all, the processing environment for products such as wafers and brackets is relatively high. The reason why Chengfeng Zhizhi chooses aluminum alloy cavity for semiconductor plasma cleaning equipment is roughly as follows:

1. Aluminum alloy has low density and high strength, which is better than high-quality steel and has better machining performance.
2. Aluminum has good electrical conductivity, thermal conductivity and corrosion resistance.
3. The material has good compatibility with chemical reactions, and it is not easy to produce metal pollution, and it will not cause pollution.
4. Aluminum alloys are rich in surface treatments, including electrophoresis, spraying, and anodizing.
5. The skin depth is more than 10 times that of aluminum and aluminum than stainless steel, which makes the current distribution more uniform and less likely to generate heat.
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