Shenzhen CRF Co., Ltd.

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Application of circuit board plasma cleaning machine in circuit board bonding treatment

       Chengfeng Zhizhi Manufacturing Co., Ltd. is a manufacturer of plasma cleaning processing technology in the semiconductor, circuit board (PCB) and other equipment manufacturing industries. For many years, it has used plasma cleaning machines to improve adhesion, innovated, and designed and manufactured a set of dedicated circuit board plasma Plasma cleaning system of cleaning machine.
Circuit board plasma cleaning machine
        Applications of plasma cleaners include:
        (1) Semiconductor and microelectronics application fields;
        (2) Glue before the die to improve the adhesion of the die;
        (3) Pre-wire bonding to improve the quality of wire bonding;
        (4) Prefabricated molds and packaging to reduce delamination;
        (5) Application of medicine and life sciences;
        (6) Cleaning and bonding of stents and catheters;
        (7) Bond incompatible materials;
        (8) Improve wettability;
        (9) Pre-flip chip underfilling can speed up fluid flow, improve fillet height and uniformity, and improve the adhesion of underfill materials.

        Chengfeng Zhizhi specializes in developing plasma technology to improve product reliability and increase output for users. Provide customers with precision distribution, fluid management, testing and inspection, as well as enhanced engineering, application, sales, service and support. With the launch of new products developed specifically for PCB, semiconductor, LED packaging and wafer-level processing and assembly, independent plasma cleaning with high efficiency and high cost for effective etching, removal and surface activation of flexible PCB (PCB) system.

Plasma cleaning machine

        In the PCB production process, the plasma cleaning system of the circuit board plasma cleaning machine is used to uniformly treat the inner surface layer of the flexible PCB before pressing, which improves the adhesion and reliability. The plasma system saves space, has a compact structure, and adopts an advanced level electrode design to achieve good material alignment. With plasma technology, the plasma system does not require temperature control, blowers or expensive fluorine-containing gases. In order to maximize cost savings, environmentally friendly and cost-effective gas plasmas such as argon (Ar) and oxygen (O2) are used.
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