Research on plasma activation process of plasma bonding aluminum wire:
　　Plasma activation process is widely used in electronics, biomedicine, jewelry making, textiles and many other industries. Due to the particularity of each industry, different equipment and processes need to be adopted according to the needs of the industry. In the electronic packaging industry, plasma plasma bonding is used to enhance the bonding quality of the aluminum wire bond/ball and the bonding strength between the chip and the epoxy resin plastic packaging material.

plasma bonding
　　 In order to better achieve the effect of lasma plasma bonding, it is necessary to understand the working principle and structure of the equipment, and design a feasible plasma activation process according to the packaging process. The working principle of plasma cleaning is to excite the injected gas into plasma, which is composed of electrons, ions, free radicals, photons and other neutral particles. Due to the existence of active particles such as electrons, ions and free radicals in the plasma, it is easy to react with the solid surface.
The type of reaction can be divided into physical reaction and chemical reaction. The physical reaction is mainly in the form of bombardment to remove the pollutants from the surface and be carried away by the gas; the chemical reaction is the reaction of active particles with pollutants to generate volatile substances and then be taken away. ".
　　In actual use, Ar gas is usually used for physical reaction, and O2 or H2 is used for chemical reaction. The plasma activation effect of plasma is usually intuitively reflected by the dripping experiment. The contact angle before plasma cleaning is about 56°, and the surface contact angle after plasma cleaning is about 7°.
　　In electronic packaging, plasma cleaning is usually performed by a physical and chemical combination to remove residual organic contaminants in raw material manufacturing, transportation, and pre-processes, as well as oxides formed on the surface of chip pads and lead frames.
　　 In the plasma plasma bonding process, it is necessary to formulate a reasonable cleaning process, such as radio frequency power, cleaning time, cleaning temperature, air velocity, etc., according to the different cleaning products, in order to achieve a good cleaning effect.
　　The plasma cleaning effect is not only related to the parameter settings of the plasma cleaning equipment, but also related to the shape of the sample and the material box of the sample. In the selection of the material box, a hollow material box is generally used to allow as much plasma gas as possible to enter the inside of the material box without disturbing the flow direction and flow speed of the plasma gas.
　　Aluminum alloy is generally used because of its good processing characteristics, light weight and easy transportation. Although glass and ceramic materials are better used in plasma activation process, they are not conducive to transportation and operation in mass production in factories.
　　 In summary, plasma plasma bonding aluminum wire is beneficial to the reliability of electronic packaging and can enhance the stability of the wire bonding process. When using the plasma cleaning process, it is necessary to combine the structure of the plasma cleaning machine cavity, design a suitable material box, and reasonably place the position of the material box in the cavity. At the same time, according to the different cleaning samples, a suitable cleaning process is found through testing to achieve a good cleaning effect.