Full automatic plasma treatment system plasma cleaning machine manufacturer plasma cleaning technology specific application: 
The main results are as follows: 1. Removing glue slag from double-layer soft plate with high aspect ratio, removing glue slag from hard and soft fusion board to improve the bonding compressive strength between hole edge and copper plating layer, removing glue slag to improve reliability and avoiding open circuit after inner layer copper plating. 
2. The surface modification activity of the front hole wall of the high frequency copper sinking Teflon plate improves the adhesion between the hole wall and the copper plating layer, and avoids the condition of black hole and burst hole. 
Anti-welding and character front plate activation can effectively avoid the loss of anti-welding characters. 
3. The through hole and blind / buried hole of laser on HDI board eliminate the carbon compounds cauterized by laser. 
Not subject to the specification of the aperture, the actual effect of the microporous plate with a diameter less than 50 μ m is more remarkable. 
4. When making the line carefully, the plasma cleaner removes the film residue of the dry film. 
5. The PI surface layer passivation treatment before the compound pressing of hard and soft plates, and the tensile force of PI surface coarsening treatment can be increased by more than ten times before the flexible circuit board is strengthened. 
6. before the electroless gold deposition / electroplating process, the surface of the finger and pad is cleaned to eliminate the anti-welding ink and other residues, and the adhesion is improved. 
Because of its reliability, some large flexible plate processing plants have selected plasma automatic equipment to replace the traditional plate grinder. 
7. After electroless gold deposition / electroplating, the surface removal of the SMT front pad improves the weldability, avoids the empty soldering rate and low soldering rate before SMT, and improves the strength. 
8. The cleaning of the surface layer before BGA packaging of PCB board, the pretreatment of gold thread, and the pre-packaging production of EMC is changed to wire / connection strength. 
9. The liquid crystal LCD industry module board removes the pollution such as glue leakage in the process of air oxidation of gold finger and pressing protective film, and cleans the surface layer before the polarizer is glued. 
10. IC Semiconductor material Industry Semiconductor material polishing wafer (Wafer), removes oxidized films and organic compounds, and the cleaning of external contaminants such as COB/COG/COF/ACF in the processing process improves the tightness and reliability. 
11. LED industry line before Wire solder plate cleaning, organic compounds removed. 
12. Like PTFE, plastic, glass, porcelain and polypropylene are not organic, so this material needs to be treated by plasma before printing and dispensing. 
Glass and porcelain surface is also slightly contaminated by metal materials can use plasma cleaning machine, silica gel functional key connectors, polymer surface modification can improve the adhesion of printing and coating.