Name	Jet type AP plasma processing system
Plasma power supply model	CRF-APO-R＆D-RXX
Rotary spray type plasma spray gun model	Rotary spray type:RXX（Option:20mm-80mm）
Power supply	220V/AC,50/60Hz
Power	1000W/25KHz（Option）
Power factor	0.8
Processing height	5-15mm
Handling wide format	Rotary jet type:20-80mm（Option）
Internal control mode	Digital control
External control mode	Start and stopI/O
Working gas	Compressed Air (0.4mpa)/N2(0.2mpa)
Power supply weight	8kg

What are the effects of the copper lead frame and the material box due to plasma treatment

　　The mechanism of plasma cleaning mainly relies on the "activation" of active particles in the plasma to achieve the purpose of removing stains on the surface of the object. In terms of reaction mechanism, plasma cleaning usually includes the following processes: inorganic gas is excited into a plasma state; gas phase substances are adsorbed on the solid surface; adsorbed groups react with solid surface molecules to form product molecules; product molecules resolve to form a gas phase; reaction The residue is detached from the surface.
　　Plasma cleaner vacuum degree related factors include the leakage rate of the vacuum chamber, the background vacuum, the pumping speed of the vacuum pump and the inlet flow rate of the process gas. The faster the pumping speed of the vacuum pump, the lower the vacuum value of the background, the less air is left in it, and the less chance the copper bracket will react with the oxygen plasma in the air; when the process gas enters, the formed plasma can be sufficient The ground reacts with the copper support, the process gas that is not excited can easily take away the reactants, the cleaning effect of the copper support will be good, and it is not easy to change color.
In order to ensure the reliability of the copper lead frame, that is, the copper bracket during wire bonding and plastic molding, and improve the yield, plasma cleaning machine is usually used to clean the copper bracket. The effect of plasma treatment is affected by multiple factors. In the past, everyone's attention will be focused. In the copper bracket itself and the selected plasma cleaning machine equipment and parameters. But in fact, several factors of the material box itself will also have a lot of influence on the effect of plasma treatment.
　　1, size
The size of the cartridge corresponding to the copper lead frame of different specifications and sizes is also different, and the size of the cartridge has a certain relationship with the effect of the plasma cleaning process. Generally speaking, the larger the size of the cartridge, the plasma enters the inside of the cartridge. The longer the time, the uniformity and effect of plasma treatment will be affected.
　　2) Spacing size
　　 The pitch mentioned here mainly refers to the distance between each layer of copper lead frame. The smaller the pitch, the effect and uniformity of plasma cleaning the copper lead frame will be correspondingly worse.
　　3) Slot feature
Put the copper lead frame into the material box for plasma cleaning treatment. If there are no slots on all sides, it will form a shield. Plasma is difficult to enter, which will affect the effect of the treatment. At the same time, what is needed is the shielding effect and the position of the slotted hole. , Slot size.

In addition, whether the lid of the material box is to be covered or not, and when to cover it, all have an impact on the plasma cleaning effect. The related factors of plasma cleaner power supply power include energy power size and unit power density. The greater the power of the power supply, the higher the plasma energy, and the stronger the surface bombardment of the copper bracket; under the same power, the less copper bracket is processed, the greater the unit power density will be, and the better the cleaning effect will be. Good, but it may cause excessive energy, discoloration or burning of the board. The plasma electric field distribution related factors of the plasma cleaning machine include electrode structure, gas flow direction and the placement position of the copper bracket. Different processing materials, process requirements and production capacity requirements have different electrode structure designs; therefore, the gas flow direction will form a gas field, which will affect the plasma movement, reaction, and uniformity; the placement of the copper bracket, It will affect the electric field and gas field characteristics, resulting in unbalanced energy distribution, and local plasma density is too large and burned.