Name	Jet type AP plasma processing system
Plasma power supply model	CRF-APO-RP1020-D
Rotary spray type plasma spray gun model	Rotary spray type: RXX (Option: 20mm-80mm)RXX（Option:20mm-80mm）
Power supply	220V/AC,50/60Hz
Power	600-1000W/25KHz（Option）
Power factor	0.98
Processing height	5-15mm
Handling wide format	Rotary jet type:20-80mm（Option）
Internal control mode	Digital control
External control mode	RS485/RS232、analog communication port, start-stop I/O
Working gas	Compressed Air (0.4mpa)/N2(0.2mpa)
Power supply weight	10kg

Use plasma surface treatment of electronic components and chips to make them more refined and clean

In the production process of electronic components, auto parts and other industrial components due to cross-contamination, natural oxidation, flux, etc., various contaminants will be formed on the surface. These contaminants will affect the welding, bonding and other related processes of the components in the subsequent production. Quality, reduce the reliability and pass rate of finished products. Plasma treatment processes the surface of the workpiece through chemical or physical action. The ionization of the reactive gas generates highly active reactive ions, which chemically react with surface contaminants for cleaning. The reaction gas needs to be selected according to the chemical composition of the pollutant. The chemical reaction-based plasma cleaning has a fast speed, good selectivity, and a good cleaning effect on organic pollutants. Plasma cleaning where the surface reaction is based on physical action is very commonly used to use argon gas, which does not produce oxidation by-products, and the etching effect is anisotropic. Generally, in the plasma surface modification process, chemical reactions and physical effects co-exist, resulting in better selectivity, uniformity and directionality.

Due to the development direction of precision and miniaturization in the industrial field, plasma surface modification technology will have more and more important applications in the semiconductor industry, chip industry, aerospace and other high-tech industries with its advantages of fine, clean, and non-destructive modification. value. The semiconductor packaging industry, including the packaging of integrated circuits, discrete devices, sensors and optoelectronics, usually uses copper lead frames. In order to improve the reliability of bonding and encapsulation, copper brackets are generally put through a plasma cleaning machine for a few minutes Treatment to remove organic matter and contaminants on the surface and increase the solderability and adhesion of the surface.