Name	Fully automatic On-Line AP plasma processing system
Model	CRF-APS-500W
Power supply	220V/AC,50/60Hz
Plasma power	1000W/13.56MHz
Effective processing height	1-8mm(MAX)
Effective processing width	120-2000mm(Option)
Processing speed	0-5m/min
Working gas	AR+O2

Fully automatic plasma treatment system plasma cleaning machine manufacturer specific application of plasma cleaning technology

1. High aspect ratio double-layer flexible board to remove slag, hard-soft fusion board to remove slag to improve the bonding compressive strength between the hole edge and the copper plating layer, remove the slag to improve reliability, and avoid the inner layer after copper plating Cause an open circuit.
2. The modified activity of the surface layer of the front hole wall of the high-frequency copper-immersed Teflon plate improves the bonding force between the hole wall and the copper plating layer, and avoids black holes and blast holes. The activation of the solder mask and the character front plate effectively prevents the solder mask characters from falling off.
3. The through holes and blind/buried holes of the laser on the HDI board eliminate the carbon compound burned by the laser. Regardless of the specification of the aperture, the actual effect of the microplate with a diameter of less than 50μm is more significant.
4. The plasma cleaner removes the thin film residue of the dry film during the meticulous line production.
5. The PI surface passivation treatment before the composite pressing of the hard and soft board, and the roughening treatment of the PI surface before the flexible circuit board reinforcement can increase the tensile strength by more than ten times.
6. Clean the surface of fingers and pads before chemical gold/electroplating process to eliminate solder mask ink and other residues and improve adhesion. Because of its reliability, some large flexible plate processing plants have selected plasma automatic equipment to replace traditional plate grinding machines.
7. After chemical gold/electroplating, the surface layer of the pad before SMT is removed to improve the solderability, avoiding the low soldering rate and low soldering rate before SMT, and improving the strength.
8. Cleaning of the surface layer before PCB BGA packaging, pre-processing of gold wire, and changing the wiring/connection strength of EMC's pre-package production and processing.
9. The LCD module board in the LCD industry removes the pollution of the gold finger air oxidation and the process of pressing the protective film, such as glue leakage, and the surface layer is cleaned before the polarizer is attached.
10. IC semiconductor material industry semiconductor material polishing wafer (Wafer), which removes oxide films and organic compounds; the cleaning of external pollutants such as COB/COG/COF/ACF during the processing process improves adhesion and reliability.
11. In the LED industry, the surface of the bonding pad before the wire is cleaned, and the organic compound is removed.
12. Like PTFE, plastic, glass, porcelain, and polypropylene are also non-organic, so this material needs to be plasma treated before printing and dispensing. The surface of glass and porcelain is also slightly polluted by metal materials. Plasma cleaners, silicone type functional key connectors, and polymer surface modification can improve the adhesion of printing and coatings.
What is the advantage of the plasma cleaning dispenser all-in-one? What are the characteristics?
Plasma cleaning dispenser is a kind of equipment that combines plasma cleaning machine and dispensing process. With the development in recent years, the process has become more and more mature, so is the plasma cleaning dispenser good? What characteristics will it have? Next, the editor of Chengfengzhi's 20-year plasma manufacturer will introduce to you.

The utility model combines a plasma cleaning machine and an automatic glue dispensing machine, and integrates plasma surface treatment and glue dispensing technology, so that the plasma cleaning glue dispensing machine has been applied in more and more practical applications, especially for some future applications. After processing the products with poor performance and poor performance, the glue can be dispensed immediately after plasma cleaning, which can achieve better dispensing effect.