Scope of application
Plasma surface treatment instruments are mainly used in the pre-treatment of mobile phone case printing, coating, and dispensing in the electronics industry, surface treatment of mobile phone screens; surface cleaning of connectors; screen printing and transfer printing pre-treatment in general industries.
Plasma cleaning equipment is generally used for plasma cleaning, etching, surface coating, plasma ashing to modify the surface of materials, etc. After plasma treatment, the wettability of the surface layer of the material can be improved, so that a variety of materials can carry out practical operations such as coating and surface coating, improve the adhesion and bonding ability, and can also remove organic chemical pollutants and oil stains. And grease. Plasma is used to modify the surface of the material, and the graft layer will form a chemical bond with the surface molecular structure, making it have excellent performance.
Plasma cleaning equipment adopts high-precision numerical control processing technology, equipped with high-precision automatic cleaning mechanical devices, and has a high degree of time control; proper plasma cleaning will not cause damage to the surface, and the process performance of the product is guaranteed; it is a This green and environmentally friendly cleaning processing technology will not cause environmental pollution, prevent the hazards of human error, and clean the surface without secondary pollution. The plasma cleaning machine has on-line production capacity and can complete automatic cleaning. Plasma cleaning will not be limited by the appearance of geometric figures, and can carry out surface treatment on small parts, plastic sheets, non-proof cloth, textile products, rubber hoses, and internal cavity PCB circuit boards. The parts will not produce mechanical deformation, it is a high-quality processing technology; and considering strict standards such as purification workshops, it is convenient to use and flexible. The actual operation is simple, and the processing effect on parts of various shapes is remarkable. The processing technology is controllable, low-cost, and effective. Very good and short time. The appearance of the processed products will not be affected by the high and low temperature of plasma treatment, and the parts are rarely exposed to heat. Plasma cleaning machine has the advantages of low operating cost, safe processing technology, and high safety in actual operation. It is also a cleaning production process with significant results after treatment.
How to understand these two chemical reactions in plasma cleaning equipment? What is the actual application?
Do you really know what the chemical reaction in plasma cleaning equipment is?
When using plasma cleaning equipment to perform surface treatment on solid materials, physical and chemical reactions are generally involved. There are two main types of chemical reactions. So how do you understand the two chemical reactions? What specific practical applications will there be?
Considering that the explanation of the chemical reaction equation is more convenient and intuitive, the reaction equation of the surface treatment process of the plasma cleaning equipment will also be explained for everyone. In the following reaction formulas, capital letters A, B, C, D, and M respectively represent different substances; lowercase letters s and g represent the solid form and gas form of the substance, respectively.
The plasma surface treatment process with the chemical formula A(g)+B(g)→C(s)+D(g):
The chemical reaction of the type of plasma cleaning equipment usually contains more than two reactive gases. The generated plasma can chemically react with solid materials. This special process application includes plasma enhanced chemical vapor deposition (PECVD), plasma sputtering and plasma體聚。 Body polymerization.
The plasma enhanced chemical vapor deposition method PECVD usually reacts two or more process gases in a plasma state to generate a new solid substance and form a thin film substance on the material substrate. This process has been widely used at present Optical film preparation and other fields.
Plasma sputtering is also a reaction that uses two or more gases to ionize into plasma. The difference is that one of the reactants is first sputtered from the target with energetic particles, and then forms a thin film through the reaction. This belongs to the category of sputtering film formation.
As for the plasma polymerization process of plasma cleaning equipment, in fact, the reactants generated by the plasma are organic monomers.
The plasma surface treatment process with chemical reaction formula A(g)+B(g)+M(s)→AB(g)+M:
This reaction process represents that the surface of the solid material M mainly plays a catalytic role and can promote the dissociation and recombination of gas molecules. In the plasma reaction of this type of plasma cleaning equipment, it is often used in the field of special gas preparation.