Semiconductor packaging and plasma cleaning activation treatment can improve the yield and reliability of semiconductor materials. Plasma treatment solutions, wafer-level packaging and micromechanical components meet the unique needs of advanced semiconductor packaging and assembly.
        Chengfeng Zhizhi plasma cleaning machine is designed for its special various special requirements, especially for semiconductor packaging and assembly, plasma processing solutions (ASPA), wafer level packaging (WLP) and micromechanical (MEMS) components. Applications of plasma activation treatment include improved cleaning, wire connection, slag removal, block adhesion, activation and etching.
Semiconductor packaging and plasma cleaning activation

        As the package size is reduced and the use of advanced materials increases, it is difficult to achieve high reliability and high yield in advanced integrated circuit manufacturing. Proper plasma cleaning and activation treatment can improve or overcome many manufacturing problems, including improving mold connections, increasing wire bond strength, eliminating flip chip underfill voids, reducing package delamination, etc., improving product yield and reliability and reducing defect rates.

        Mold connection-Plasma cleaning substrate surface activation improves the adhesion between the chip and the epoxy resin, improves the adhesion between the mold and the substrate, and better promotes heat dissipation. In addition, when the eutectic welding material is used as the bonding material, oxidation will adversely affect the bonding performance of the mold. Plasma activation treatment is used to remove the oxidation of the metal surface to ensure that the mold is connected without holes.
        Pollution sources in the previous process or the intersection of different materials often result in low adhesion and low yield. Before plasma cleaning the circuit board, plasma technology can be used for wire connection to improve the connection strength and product yield.
        Experiments have shown that plasma surface treatment before underfill can increase the wicking speed of underfill, increase fillet height and uniformity, reduce urination, and improve underfill adhesion. The mechanism is the change of surface energy and surface chemical composition. By increasing the surface energy of the substrate, the encapsulation and plasma treatment after the molding of the mold improves the adhesion of the mold compound, improves the adhesion performance and improves the reliability of the encapsulation.
        During the manufacturing process, various metal devices, such as accelerometers, rolling sensors, and airbag sensors, require advanced plasma activation processing for the semiconductor components contained in them to improve device yield and long-term reliability. Typical applications include equipment plasma cleaning, photoresist removal, photoresist, photoresist, liner stripping (PCB), etching tapping, and pollution elimination. Other applications include surface cleaning and roughening, increasing the activation of solderable chemical bonds, and improving the wettability and fluidity of the wafer surface.