Plasma cleaning machine technology, plastic, metal, ceramic, glass and other pre-treatment to improve adhesion:
Plasma cleaner technology is widely used in many fields such as optical electronics, semiconductors, biomedicine, composite materials, flat panel displays, new energy, and general industry.

1. Electronics industry
A. Filling: Improve the adhesion of the infusion
Filling refers to protecting electronic components by pouring resin. Plasma activation before filling can ensure good sealing, reduce current leakage, and provide good bonding performance. Filling provides insulation to prevent the effects of moisture, high/low temperature, physical and electronic stress. It also has the functions of flame retardant, shock absorption and heat dissipation.
B. The cleaning of the bonding board: improve the wire bonding effect;
C. Improve the bonding performance of plastic materials
Plasma cleaning machine technology is very suitable for processing plastic, metal, ceramic, glass and other materials before bonding. In application, the loose boundary film is removed, leaving a very clean surface. It can roughen the surface at the atomic level, provide more surface bonding positions, and improve the bonding effect. At the same time, the active atoms in the plasma chemically change the surface to form a strong chemical bond on the surface of the matrix material.

2. Medical application of plasma cleaner
A. Activation: improve the adhesion of cells and biomaterials to clinical diagnostic platforms;
B. Ammonia: Ammonia provides polymer materials with binding points that can bind biological and sensor molecules;
C. Other functionalities: Improve the selective adhesion of biologically active molecules to cell culture platforms.
3. Medical equipment
A. Microfluidic device: The microfluidic device needs a hydrophilic surface so that the analyte can flow smoothly through it continuously;
B. Medical catheters: Minimize prothrombin and improve biocompatibility by reducing protein adhesion on the catheter;
C. Drug delivery: solve the problem of drug sticking to the wall of the metering cavity;
D. Prevent biological contamination: Improve the biocompatibility of medical devices in vivo and in vitro.
4. Application in optical field of plasma cleaner
A. Lens cleaning: remove organic film;
B. Contact lenses: improve the wettability of contact lenses;
C. Optical fiber: Improve the optical transmission of optical fiber connectors.
5. Rubber
A. Surface friction: reduce the surface friction of the sealing strip and the O-ring;
B. Bonding: To improve the bonding force of the adhesive to the rubber, the ions in the plasma are used to accelerate the impact on the surface or chemical etching to selectively change the surface morphology, thereby providing more bonding points and improving adhesion.
6. Application of printed circuit board (PCB) of plasma cleaning machine
A. Remove the slag in the hole, and the slag in the hole must be removed before gold plating. This glue residue is also mainly hydrocarbons, which can easily react with ions or free radicals in the plasma to generate volatile carbon hydroxides, which are then taken out by the vacuum system;
B. Teflon activation: Teflon (polytetrafluoroethylene) has low conductivity and is a good material to ensure fast signal transmission and insulation. But these characteristics make Teflon difficult to electroplating. Therefore, plasma must be used to activate the surface of Teflon before copper plating;
C. Carbide removal: Carbide generated during laser drilling will affect the effect of copper plating in the hole. Plasma can be used to remove carbides in the holes. The active components in the plasma react with carbon to generate volatile gas, which is pumped away by a vacuum pump. For FPC, the residual glue after pressing, silk screen and other high-polluting processes will cause problems such as leakage plating and different colors during the subsequent surface treatment. Plasma can be used to remove the residual glue;
D. Cleaning function: Before the circuit board is shipped, plasma will be used for one-time surface cleaning. Enhance the wire bonding strength, tension, etc.
7. CD
A. Cleaning: the disc template is clean;
B. Passivation: template passivation;
CImprovement: Eliminate duplication stains.
8. Semiconductor industry
A. Silicon wafer and wafer manufacturing: removal of photoresist;
B. Micro-Electro-Mechanical System (MEMS): removal of SU-8 glue;
C. Chip packaging: cleaning the lead pads, underfilling the flip chip, and improving the bonding effect of the sealant;
D. Failure analysis: disassembly and assembly; e. electrical connectors, aviation sockets, etc.
9. Application of plasma cleaning machine to solar cell
Etching of solar cells and pre-processing of solar cell packaging.
10. Flat panel display
A. Cleaning and activation of ITO panels;
B. Removal of photoresist;
C. Bonding point cleaning (COG).